The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2008

Filed:

Mar. 21, 2005
Applicants:

In-jun Kim, Inoheon-gwangyeoksi, KR;

Jung-keun Cho, Seoul, KR;

Jang-seob Choi, Cheonan-si, KR;

Yong-nam Choi, Seoul, KR;

Jeong-yong Bae, Cheonan-si, KR;

Inventors:

In-Jun Kim, Inoheon-gwangyeoksi, KR;

Jung-Keun Cho, Seoul, KR;

Jang-Seob Choi, Cheonan-si, KR;

Yong-Nam Choi, Seoul, KR;

Jeong-Yong Bae, Cheonan-si, KR;

Assignee:

Semes Co., Ltd., Chungcheongnam, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.


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