The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2008
Filed:
Jul. 27, 2005
Applicants:
Song Hak Kim, Seoul, KR;
Jae Sung Kwak, Seoul, KR;
Inventors:
Song Hak Kim, Seoul, KR;
Jae Sung Kwak, Seoul, KR;
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered horn is coupled to the body section for transferring and concentrating the ultrasonic wave. A capillary is coupled to a front section of the horn. The capillary has a channel running the length thereof. A wire is inserted through the channel. A discharge device is coupled to the capillary for forming a ball on the wire for wire bonding.