The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2008
Filed:
Apr. 17, 2007
Cheng-chou Hung, Chang-Hua Hsien, TW;
Hua-chou Tseng, Hsin-Chu, TW;
Victor-chiang Liang, Hsin-Chu, TW;
Yu-chia Chen, Taipei, TW;
Tsun-lai Hsu, Hsin-Chu Hsien, TW;
Cheng-Chou Hung, Chang-Hua Hsien, TW;
Hua-Chou Tseng, Hsin-Chu, TW;
Victor-Chiang Liang, Hsin-Chu, TW;
Yu-Chia Chen, Taipei, TW;
Tsun-Lai Hsu, Hsin-Chu Hsien, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
A substrate is provided and a top interconnection metal layer and a primary winding layer are formed thereon. Then a passivation layer having a plurality of via exposed parts of the top interconnection metal layer is formed on the substrate. A secondary winding layer and at least a bonding pad are formed on the passivation layer. The bonding pad electrically connects to the top interconnection metal layer through the via.