The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7315827 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 01, 2008

Filed:

Apr. 12, 2004
Applicants:

Hui-jye Hshieh, Hsin-Chu, TW;

Tu Shao Chi, Hsin-Chu, TW;

Jung-yi Tsai, Hsin-Chu, TW;

Chui-chung Chiu, Hsin-Chu, TW;

Wendy Chang, Taipei, TW;

Inventors:

Hui-Jye Hshieh, Hsin-Chu, TW;

Tu Shao Chi, Hsin-Chu, TW;

Jung-Yi Tsai, Hsin-Chu, TW;

Chui-Chung Chiu, Hsin-Chu, TW;

Wendy Chang, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.


Find Patent Forward Citations

Hshieh, Hui-Jye. (2008). Method and system for communicating semiconductor manufacturing information to customers (U.S. Patent No. 7315827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7315827

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