The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2008
Filed:
May. 31, 2005
Yusuke Igarashi, Gunma, JP;
Takeshi Nakamura, Gunma, JP;
Yasunori Inoue, Gifu, JP;
Hideki Mizuhara, Aichi, JP;
Ryosuke Usui, Aichi, JP;
Yusuke Igarashi, Gunma, JP;
Takeshi Nakamura, Gunma, JP;
Yasunori Inoue, Gifu, JP;
Hideki Mizuhara, Aichi, JP;
Ryosuke Usui, Aichi, JP;
Sanyo Electric Co., Ltd., Moriguchi, Osaka, JP;
Abstract
A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing method thereof, a first conductive film is laminated on a first insulating layer, and a first wiring layer is formed by patterning the first conductive film. Next, a second conductive film is laminated on a second insulating layer. Thereafter, by partially removing the second insulating layer and the second conductive film in a desired spot, a connection part for connecting the wiring layers to each other is formed.