The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2008
Filed:
Aug. 13, 2004
Applicant:
Yam MO Wong, Singapore, SG;
Inventor:
Yam Mo Wong, Singapore, SG;
Assignee:
ASM Technology Singapore Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 1/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a base in contact with the bonding surface, a recessed portion formed substantially at an edge of the bonded wire wherein at least a portion of an underside of the recessed portion is in contact with the bonding surface, and a length of wire extending from the recessed portion.