The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Mar. 31, 2003
Naoko Yamaguchi, Yokohama, JP;
Yoshiaki Sugizaki, Yokohama, JP;
Hideo Aoki, Yokohama, JP;
Toshiro Hiraoka, Yokohama, JP;
Yasuyuki Hotta, Tokyo, JP;
Shigeru Matake, Yokohama, JP;
Misa Sawanobori, Yokohama, JP;
Naoko Yamaguchi, Yokohama, JP;
Yoshiaki Sugizaki, Yokohama, JP;
Hideo Aoki, Yokohama, JP;
Toshiro Hiraoka, Yokohama, JP;
Yasuyuki Hotta, Tokyo, JP;
Shigeru Matake, Yokohama, JP;
Misa Sawanobori, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor test unit comprises a test circuit for inputting/outputting a test signal to/from an examined electronic product, a test signal wiring electrically connected to the test circuit, a contact board electrically connected to an electrode of the examined electronic product and provided with an electrically conductive via to which the test signal is transmitted, a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located under the bottom face of the contact board, and provided with at least one through-hole, and a vacuum attachment mechanism for attaching thereto and holding the examined electronic product, the contact board, and the multilayer circuit board by vacuum. The contact board is made of an insulative material, has top and bottom faces, and is provided with at least one through-hole.