The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7312401 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 25, 2007

Filed:

Sep. 20, 2005
Applicants:

Kiyotaka Tsukada, Nagoya, JP;

Terumasa Ninomaru, Gifu-Hashima, JP;

Masaki Kizaki, Gifu-Hashima, JP;

Inventors:

Kiyotaka Tsukada, Nagoya, JP;

Terumasa Ninomaru, Gifu-Hashima, JP;

Masaki Kizaki, Gifu-Hashima, JP;

Assignee:

Ibiden Co., Ltd., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.


Find Patent Forward Citations

Tsukada, Kiyotaka. (2007). Flexible printed wiring board (U.S. Patent No. 7312401). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7312401

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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