The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2007
Filed:
Jun. 25, 2004
Tae-min Eom, Sungnam-si, KR;
Yu-sin Yang, Sungnam-si, KR;
Chung-sam Jun, Suwon-si, KR;
Yun-jung Jee, Yongin-si, KR;
Joung-soo Kim, Gyeonggi-do, KR;
Moon-kyung Kim, Goyang-si, KR;
Sang-mun Chon, Yongin-si, KR;
Sun-yong Choi, Sungnam-si, KR;
Tae-Min Eom, Sungnam-si, KR;
Yu-Sin Yang, Sungnam-si, KR;
Chung-Sam Jun, Suwon-si, KR;
Yun-Jung Jee, Yongin-si, KR;
Joung-Soo Kim, Gyeonggi-do, KR;
Moon-Kyung Kim, Goyang-si, KR;
Sang-Mun Chon, Yongin-si, KR;
Sun-Yong Choi, Sungnam-si, KR;
Abstract
In a method and an apparatus for inspecting a wafer surface, a wafer is loaded into a chamber. An incident light including a first light for sensing a vertical position of the wafer and a second light for inspecting the wafer surface is irradiated onto the wafer. The first light is reflected on an inspection region or a next inspection region of the wafer and is detected to control a wafer position. The second light is scattered on the inspection region and is detected to inspect the wafer surface of the inspection region. Position information of a wafer is examined and a position of the wafer is adjusted before inspecting a surface of inspection region of a wafer so as to enable accurate inspection of the wafer surface.