The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2007
Filed:
Jun. 30, 2005
Suk-chae Kang, Gyeonggi-do, KR;
Sa-yoon Kang, Seoul, KR;
Dong-han Kim, Gyeonggi-do, KR;
Si-hoon Lee, Gyeonggi-do, KR;
Suk-Chae Kang, Gyeonggi-do, KR;
Sa-Yoon Kang, Seoul, KR;
Dong-Han Kim, Gyeonggi-do, KR;
Si-Hoon Lee, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one or more decoupling capacitors. The semiconductor chip is in direct contact with the metal plate to improve thermal characteristics, and the substrate is supported by the metal plate to increase mechanical stability of the package. The one or more openings in the metal plate accommodate the passing therethrough of plural pins electrically connected via the printed wire pattern substrate to the semiconductor chip. The semiconductor package can be usefully applied to a digital micro-mirror device (DMD) semiconductor package for use in a projection display device.