The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2007
Filed:
Sep. 26, 2003
Phillip Joe Brock, Sunnyvale, CA (US);
Michael W. Chaw, San Jose, CA (US);
Dan Dawson, San Jose, CA (US);
Craig Hawker, Los Gatos, CA (US);
James L. Hedrick, Pleasanton, CA (US);
Teddie P. Magbitang, Sunnyvale, CA (US);
Dennis Mckean, Milpitas, CA (US);
Robert D. Miller, San Jose, CA (US);
Richard I. Palmisano, San Martin, CA (US);
Willi Volksen, San Jose, CA (US);
Phillip Joe Brock, Sunnyvale, CA (US);
Michael W. Chaw, San Jose, CA (US);
Dan Dawson, San Jose, CA (US);
Craig Hawker, Los Gatos, CA (US);
James L. Hedrick, Pleasanton, CA (US);
Teddie P. Magbitang, Sunnyvale, CA (US);
Dennis McKean, Milpitas, CA (US);
Robert D. Miller, San Jose, CA (US);
Richard I. Palmisano, San Martin, CA (US);
Willi Volksen, San Jose, CA (US);
Abstract
An encapsulant fluid is provided comprising a mixture of a diene-containing compound and a dienophilic compound. At least one of the diene-containing and the dienophilic compounds is protected so that the compounds do not substantially react with each other at room temperature. The diene-containing and the dienophilic compounds undergo a reversible Diels-Alder polymerization reaction at a polymerization temperature above room temperature to form a solid debondable polymeric encapsulant. Also provided are methods for forming slider assemblies and methods for patterning a slider surface using the encapsulant.