The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7307004 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 11, 2007

Filed:

Nov. 05, 2004
Applicants:

Cheng-ya Yu, Taipei, TW;

Sun-rong Jan, Taipei, TW;

Shu-tong Chang, Taipei, TW;

Chee-wee Liu, Taipei, TW;

Inventors:

Cheng-Ya Yu, Taipei, TW;

Sun-Rong Jan, Taipei, TW;

Shu-Tong Chang, Taipei, TW;

Chee-Wee Liu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method with a mechanically strained silicon for enhancing the speeds of integrated circuits or devices is disclosed. The method with a mechanically strained silicon for enhancing the speeds of integrated circuits or devices includes the following steps: (a) providing a substrate, (b) fixing the substrate, (c) applying a stress upon the substrate, and (d) inducing a strain in one of a device and a circuit by stressing the substrate.


Find Patent Forward Citations

Yu, Cheng-Ya. (2007). Method with mechanically strained silicon for enhancing speed of integrated circuits or devices (U.S. Patent No. 7307004). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7307004

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