The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2007
Filed:
Apr. 16, 2004
Applicants:
Yonggang Jin, Singapore, SG;
Shelley Yong, Singapore, SG;
Puay Gek Chua, Singapore, SG;
Won Sun Shin, Suwon, KR;
Inventors:
Yonggang Jin, Singapore, SG;
Shelley Yong, Singapore, SG;
Puay Gek Chua, Singapore, SG;
Won Sun Shin, Suwon, KR;
Assignee:
ST Assembly Test Services Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.