The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2007
Filed:
Aug. 30, 2006
Kazuaki Kozasa, Hiratsuka, JP;
Motoharu Yamada, Hiratsuka, JP;
Yasuhiro Tomita, Hiratsuka, JP;
Hiromi Wakabayashi, Hiratsuka, JP;
Kazuaki Kozasa, Hiratsuka, JP;
Motoharu Yamada, Hiratsuka, JP;
Yasuhiro Tomita, Hiratsuka, JP;
Hiromi Wakabayashi, Hiratsuka, JP;
Sumco Techxiv Corporation, Hiratsuka-shi, JP;
Abstract
A polishing method includes a slurry adjusting step for adjusting a polishing slurry containing silica particles so that the number of silica particles having a composition ratio of Si/O of 50–60 wt %/40–50 wt %, a modulus of elasticity of 1.4×10Pa or higher and a particle size of 1 μm or larger is 3000 pcs/ml or less. A semiconductor wafer is polished using the polishing slurry adjusted in the slurry adjusting step.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile