The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2007

Filed:

Mar. 20, 2006
Applicants:

Hirotaka Nishizawa, Fuchu, JP;

Haruji Ishihara, Kawaguchi, JP;

Atsushi Shiraishi, Kodaira, JP;

Kouichi Kanemoto, Koganei, JP;

Yousuke Yukawa, Kokubunji, JP;

Inventors:

Hirotaka Nishizawa, Fuchu, JP;

Haruji Ishihara, Kawaguchi, JP;

Atsushi Shiraishi, Kodaira, JP;

Kouichi Kanemoto, Koganei, JP;

Yousuke Yukawa, Kokubunji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.


Find Patent Forward Citations

Loading…