The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2007
Filed:
Jul. 01, 2003
Ka Shing Kwan, Singapore, SG;
Guoshen HU, Singapore, SG;
Tingyu He, Singapore, SG;
Yie MI, Singapore, SG;
Yam MO Wong, Singapore, SG;
Ka Shing Kwan, Singapore, SG;
Guoshen Hu, Singapore, SG;
Tingyu He, Singapore, SG;
Yie Mi, Singapore, SG;
Yam Mo Wong, Singapore, SG;
ASM Technology Singapore Pte Ltd., Singapore, SG;
Abstract
The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.