The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2007

Filed:

Aug. 16, 2005
Applicants:

Jeffrey A. Brody, Hopewell Junction, NY (US);

Hsichang Liu, Fishkill, NY (US);

Hai Pham Longworth, Poughkeepsie, NY (US);

James C. Monaco, Stormville, NY (US);

Gerard J. Nuzback, Hopewell Junction, NY (US);

Wei Zou, Wappingers Falls, NY (US);

Inventors:

Jeffrey A. Brody, Hopewell Junction, NY (US);

Hsichang Liu, Fishkill, NY (US);

Hai Pham Longworth, Poughkeepsie, NY (US);

James C. Monaco, Stormville, NY (US);

Gerard J. Nuzback, Hopewell Junction, NY (US);

Wei Zou, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuss button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly.


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