The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Oct. 24, 2006
Satoru Konishi, Saku, JP;
Tsuneo Endoh, Komoro, JP;
Masaaki Tsuchiya, Tobu, JP;
Hirokazu Nakajima, Saku, JP;
Satoru Konishi, Saku, JP;
Tsuneo Endoh, Komoro, JP;
Masaaki Tsuchiya, Tobu, JP;
Hirokazu Nakajima, Saku, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board.