The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Aug. 29, 2005
Tadatomo Suga, Nakano-ku, JP;
Toshihiro Itoh, Chiba, JP;
Tadatomo Suga, Nakano-ku, JP;
Toshihiro Itoh, Chiba, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Other;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Sony Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Fujitsu Limited, Kanagawa, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Renesas Technology Corp., Tokyo, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather than a sealing material. The frame member in the present invention surrounds electrodes formed on the substrates. The inside of the frame member is vacuous or filled with a gas which does not react with the electrodes such as an inert gas and, thereby, the electrodes are prevented from deteriorating by attacks of oxygen or moisture.