The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Jul. 26, 2004
Chien-jung Wang, Kaohsiung, TW;
Su-chen Fan, Chung-Li, TW;
Ding-da HU, Taichung, TW;
Hsueh-chung Chen, Yonghe, TW;
Chien-Jung Wang, Kaohsiung, TW;
Su-Chen Fan, Chung-Li, TW;
Ding-Da Hu, Taichung, TW;
Hsueh-Chung Chen, Yonghe, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A wiring structure with improved resistance to void formation and a method of making the same are described. The wiring structure has a first conducting layer that includes a large area portion which is connected to an end of a protrusion with a plurality of 'n' overlapping segments and at least one bending portion. The other end of the protrusion is connected to the bottom of a via which has an overlying second conducting layer. A bend is formed by overlapping the ends of two adjacent segments at an angle between 45° and 135°. The protrusion may also include at least one extension at a segment end beyond a bend. A bending portion and extension are used as bottlenecks to delay the diffusion of a vacancy from the large area portion to the vicinity of the via and is especially effective for copper interconnects or in a via test structure.