The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Jun. 03, 2005
Christopher P. Schaffer, Fallbrook, CA (US);
Chuan Cheah, Redondo Beach, CA (US);
Kevin HU, Santa Monica, CA (US);
Christopher P. Schaffer, Fallbrook, CA (US);
Chuan Cheah, Redondo Beach, CA (US);
Kevin Hu, Santa Monica, CA (US);
International Rectifier Corporation, El Segundo, CA (US);
Abstract
The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each other without wire bonding. The common housing includes a packaging structure, the packaging structure including a connective portion and at least one web portion, which aids in the thermal management of the heat emitted by the plurality of flip chip devices and which connects the flip chip devices to each other. Passive devices in the circuit may also be arranged in a planar fashion in the common housing.