The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Dec. 10, 2002
Jun Liu, Brookfield, CT (US);
Peter Wrschka, Danbury, CT (US);
David Bernhard, Kooskia, ID (US);
Mackenzie King, Southbury, CT (US);
Michael Darsillo, Woodbury, CT (US);
Karl Boggs, Hopewell Junction, NY (US);
Jun Liu, Brookfield, CT (US);
Peter Wrschka, Danbury, CT (US);
David Bernhard, Kooskia, ID (US);
MacKenzie King, Southbury, CT (US);
Michael Darsillo, Woodbury, CT (US);
Karl Boggs, Hopewell Junction, NY (US);
Advanced Technology Materials, Inc., Danbury, CT (US);
Abstract
A CMP composition containing 5-aminotetrazole, e.g., in combination with oxidizing agent, chelating agent, abrasive and solvent. Such CMP composition advantageously is devoid of BTA, and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions, e.g., Cu, in the bulk CMP composition at the copper/CMP composition interface during CMP processing.