The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2007

Filed:

Jun. 16, 2004
Applicants:

Yoichi Kobayashi, Tokyo, JP;

Ryuichiro Mitani, Tokyo, JP;

Inventors:

Yoichi Kobayashi, Tokyo, JP;

Ryuichiro Mitani, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2006.01); B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polished state monitoring apparatus capable of easily grasping the progress of polishing is provided. The polished state monitoring apparatus monitors the progress of polishing of a surface to be polished by obtaining a characteristic value indicating a state of the polished surface of an object at each sampling point every predetermined interval while scanning the surface. The apparatus includes light emitting means capable of emitting light for irradiating the surface and computing units for receiving light reflected from the surface to generate a characteristic value. Then, the apparatus fetches the characteristic values obtained from the sampling points at the same sampling timing during each scan and outputs the characteristic values. This enables the progress of the polishing to be monitored in accordance with the distance from the center of the surface.


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