The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2007

Filed:

Dec. 02, 2004
Applicants:

Pei Chen, Campbell, CA (US);

Jorge Goitia, San Jose, CA (US);

Cherngye Hwang, San Jose, CA (US);

Bigal Leung, Redwood City, CA (US);

Diana Perez, San Jose, CA (US);

Yongjian Sun, San Jose, CA (US);

Inventors:

Pei Chen, Campbell, CA (US);

Jorge Goitia, San Jose, CA (US);

Cherngye Hwang, San Jose, CA (US);

Bigal Leung, Redwood City, CA (US);

Diana Perez, San Jose, CA (US);

Yongjian Sun, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 25/00 (2006.01); F25D 17/06 (2006.01); F25D 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.


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