The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2007

Filed:

Aug. 09, 2005
Applicants:

Yong Zhong, Shenzhen, CN;

Bo-yong Yang, Shenzhen, CN;

Wan-lin Xia, Shenzhen, CN;

Inventors:

Yong Zhong, Shenzhen, CN;

Bo-Yong Yang, Shenzhen, CN;

Wan-Lin Xia, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Bao'an District, Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A fastening assembly is for securing a heat sink to a heat generating electronic device located on a printed circuit board. The fastening assembly includes a first element and a second element slidably received in the first element. The first element includes a pressing portion, a plurality of outer flexible portions located below the pressing portion and a plurality of inner flexible portions integrally extending inwards from the outer flexible portions, respectively. The pressing portion of the first element presses downwardly the heat sink toward the electronic device. The outer flexible portions of the first element abut upwardly against the printed circuit board. The second element is capable of acting on the inner flexible portions of the first element to motivate the outer flexible portions to release their abutment from the printed circuit board.


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