The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2007

Filed:

Nov. 03, 2005
Applicants:

Hsieh-kun Lee, Tu-Cheng, TW;

Wan-lin Xia, Shenzhen, CN;

Tao LI, Shenzhen, CN;

Min-qi Xiao, Shenzhen, CN;

Inventors:

Hsieh-Kun Lee, Tu-Cheng, TW;

Wan-Lin Xia, Shenzhen, CN;

Tao Li, Shenzhen, CN;

Min-Qi Xiao, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Bao'an District, Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device includes a first heat sink (), a second heat sink () and four heat pipes () thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins () and the second heat sink comprises a plurality of second heat dissipation fins (). Each heat pipe comprises an evaporating portion () and a condensing portion (). The evaporating portions of two heat pipes thermally engage in a base of the first heat sink and the condensing portions thereof connect the first and second heat dissipation fins. The evaporating portions of the other two heat pipes thermally engage in a base of the second heat sink and the condensing portions thereof connect the second and first heat dissipation fins.


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