The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7295027 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 13, 2007

Filed:

Mar. 21, 2005
Applicant:

Hajime Matsuzawa, Tokyo, JP;

Inventor:

Hajime Matsuzawa, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device socket, in which a semiconductor device is installed, includes a support member on which a substrate is placed, an anisotropic conductive sheet that acts as an intermediary in electric connection between the substrate and the semiconductor device, and heater which heats the anisotropic conductive sheet. The heater heats the anisotropic conductive sheet for expanding the sheet before the semiconductor device is installed in the semiconductor device socket. The semiconductor device is installed in the socket after the anisotropic conductive sheet has been expanded by heat from the heater.


Find Patent Forward Citations

Matsuzawa, Hajime. (2007). Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet (U.S. Patent No. 7295027). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7295027

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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