The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7291902 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 06, 2007

Filed:

Dec. 15, 2005
Applicants:

Youssef Gannoune, Munich, DE;

Christian Stocken, Munich, DE;

Inventors:

Youssef Gannoune, Munich, DE;

Christian Stocken, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chip component () includes a semiconductor body (), in which at least one switchable element () is arranged in a partial region () of the semiconductor body (). The partial region () can be reached by light of at least one wavelength. Furthermore, a circuit () integrated into the semiconductor body () is provided, which integrated circuit can assume one configuration from at least two possible configurations, one of these configurations being prescribed by a state of the at least one switchable element (). Furthermore, a housing () is provided, which encloses the semiconductor body () and is arranged with a partial region () at least partly above the partial region () of the semiconductor body (). The partial region () of the housing () is formed in such a way that light can be fed to the partial region () of the semiconductor body (). It is thus possible even after a fabrication process to carry out a test and, if appropriate, to define a different configuration through switching of the element ().


Find Patent Forward Citations

Gannoune, Youssef. (2007). Chip component and method for producing a chip component (U.S. Patent No. 7291902). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7291902

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