The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2007
Filed:
Jun. 24, 2003
Norio Kimura, Kanagawa, JP;
Yu Ishii, Kanagawa, JP;
Hirokuni Hiyama, Tokyo, JP;
Katsuya Okumura, Tokyo, JP;
Hiroyuki Yano, Kanagawa, JP;
Norio Kimura, Kanagawa, JP;
Yu Ishii, Kanagawa, JP;
Hirokuni Hiyama, Tokyo, JP;
Katsuya Okumura, Tokyo, JP;
Hiroyuki Yano, Kanagawa, JP;
Ebara Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Kawasaki-Shi, JP;
Abstract
A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface. The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.