The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2007

Filed:

Oct. 11, 2005
Applicants:

Darrell E. Schlicker, Watertown, MA (US);

Neil J. Goldfine, Newton, MA (US);

Andrew P. Washabaugh, Chula Vista, CA (US);

Yanko K. Sheiretov, Waltham, MA (US);

Mark D. Windoloski, Chelmsford, MA (US);

Inventors:

Darrell E. Schlicker, Watertown, MA (US);

Neil J. Goldfine, Newton, MA (US);

Andrew P. Washabaugh, Chula Vista, CA (US);

Yanko K. Sheiretov, Waltham, MA (US);

Mark D. Windoloski, Chelmsford, MA (US);

Assignee:

JENTEK Sensors, Inc., Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 7/34 (2006.01); G06F 17/40 (2006.01); G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Local features such as cracks in materials are nondestructively characterized by measuring a response with an electromagnetic sensor and converting this response into a selected property using a database. The database is generated prior to data acquisition by using a model to generate a baseline response or field distribution for the sensor and combining these results with another model, which may be simpler than the first model or provide a local representation of the field perturbations around a feature, which is evaluated multiple times over a range of values of the selected property. In addition, the presence of a feature may be detected by converting the sensor response into a reference parameter, such as a lift-off factor that reflects the sensor position relative to a material edge, and using this parameter to determine a reference response that can be compared to the measured response.


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