The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2007

Filed:

Nov. 14, 2002
Applicants:

Nam-soo Kim, Suwon-si, KR;

Sang-mun Chon, Seongnam-si, KR;

Young-sam Lim, Seoul, KR;

Kyoung-moon Kang, Busan-si, KR;

Sei-cheol Lee, Seoul, KR;

Jae-hyun SO, Seoul, KR;

Dong-jun Lee, Yongin-si, KR;

Inventors:

Nam-Soo Kim, Suwon-si, KR;

Sang-Mun Chon, Seongnam-si, KR;

Young-Sam Lim, Seoul, KR;

Kyoung-Moon Kang, Busan-si, KR;

Sei-Cheol Lee, Seoul, KR;

Jae-Hyun So, Seoul, KR;

Dong-Jun Lee, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C09K 13/04 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and a second base material. A slurry composition is prepared by mixing the additive composition, a polishing particle composition, and water. When implementing a chemical mechanical polishing using the slurry composition, a favorable polishing selectivity is realized.


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