The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
May. 26, 2004
Kazuhiko Bandoh, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Takaki Kuno, Kyoto, JP;
Yoshinori Noguchi, Kyoto, JP;
Satoshi Kitaoka, Nagoya, JP;
Naoki Kawashima, Nagoya, JP;
Kazuhiko Bandoh, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Takaki Kuno, Kyoto, JP;
Yoshinori Noguchi, Kyoto, JP;
Satoshi Kitaoka, Nagoya, JP;
Naoki Kawashima, Nagoya, JP;
Towa Corporation, Kyoto-shi, JP;
Japan Fine Ceramics Center, Nagoya-shi, JP;
Abstract
A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 μm; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.