The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Mar. 22, 2006
Wiren Dale Becker, Hyde Park, NY (US);
William Louis Brodsky, Binghamton, NY (US);
Evan George Colgan, Chestnut Ridge, NY (US);
Michael Ford Mcallister, New Milford, CT (US);
Edward Seminaro, Milton, NY (US);
John Torok, Poughkeepsie, NY (US);
Wiren Dale Becker, Hyde Park, NY (US);
William Louis Brodsky, Binghamton, NY (US);
Evan George Colgan, Chestnut Ridge, NY (US);
Michael Ford McAllister, New Milford, CT (US);
Edward Seminaro, Milton, NY (US);
John Torok, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile