The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Dec. 10, 2004
Takstoshi Ishikawa, Fukuoka, JP;
Makoto Okazaki, Saga, JP;
Tadahiko Sakai, Fukuoka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
In a mounting method for mounting a bump-equipped electronic componentwith a plurality of metallic bumpson a substratewith a plurality of electrodesduring the process of connecting the metallic bumpsto the electrodesby aligning the metallic bumps with the electrodeswith thermosetting resinintervening between the electronic componentand substrateand by pressing the electronic componentto the substratewhile exerting ultrasonic oscillation, heat and applied pressure on the electronic componentall of the metallic bumpsare brought into contact with the electrodes so that they are electrically connected to each other, and when some of the metallic bumps are metallic-bonded to the electrodes, ultrasonic oscillation is stopped. Thus, it is possible to prevent occurrence of damage owing to the excessive exertion of ultrasonic oscillation on the metallic bumps which have precedently started their metallic-bonding.