The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Oct. 11, 2004
David C. H. Cheng, Taoyuan Hsien, TW;
David C. H. Cheng, Taoyuan Hsien, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A fabrication process of a conductive column suitable for a fabrication of a circuit board. The circuit board comprises a dielectric layer. A first blind hole is formed in the dielectric layer from a second surface opposite to the first surface, wherein the blind end of the first blind hole connects to the blind end of the second blind hole. The first blind hole and the second blind hole constitute a through hole. The through hole is formed in an hourglass shape such that an inner diameter of the through hole near the first or the second surface is substantially larger than an inner diameter of the through hole near a middle portion of the through hole. A conductive material is filled in the though hole to form a conductive column.