The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Nov. 12, 2004
Alexander Brandorff, New Milford, CT (US);
Alexander Brandorff, New Milford, CT (US);
Wentworth Laboratories, Inc., Brookfield, CT (US);
Abstract
An upper die portion () of a die head for aligning probe pins () in first array of first micro-holes () formed in lower die portion () of the die head, which generally includes a spacer portion (), a support frame (), and first and second assembly aid films () and (), respectively. Spacer portion () is adapted to contact lower die portion (). First assembly aid film () is typically positioned between second surface () and support frame () and includes a second array of second micro-holes () adapted to receive probe pins (). Second assembly aid film () generally is in contact or close proximity to first assembly aid film () and has a third array of third micro-holes () adapted to receive probe pins (). Second array of second micro-holes () and third array of third micro-holes () are patterned to align with one another but are both offset with first array of first micro-holes () by approximately the lateral distance between probe tip () and probe head ().