The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2007

Filed:

Sep. 02, 2003
Applicants:

Katsuyuki Yamamoto, Itami, JP;

Kimihito Wada, Nishinomiya, JP;

Inventors:

Katsuyuki Yamamoto, Itami, JP;

Kimihito Wada, Nishinomiya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A02D 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A doughnut like a dumpling covered with sesame seeds is prepared using a powdery raw material, which comprises 50 to 80 parts by weight of ungelatinized starch, 6 to 25 parts by weight of pregelatinized starch, 7 to 30 parts by weight of wheat flour and 7 to 25 parts by weight of a saccharide. Dough used for the preparation of a doughnut like a dumpling covered with sesame seeds is obtained by adding water and, if needed, a seasoning component to the foregoing powdery raw material to thus form dough, dividing the resulting dough into small pieces and forming each small piece into a desired shape and, if needed, stuffing the shaped dough with fillings. The foregoing doughnut can be prepared by frying the foregoing dough. The doughnut like a dumpling covered with sesame seeds is excellent in the storage stability and has excellent sticky and resilient feeling upon eating like a rice cake.


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