The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Oct. 18, 2005
Yang Je Lee, Chungcheongbuk-do, KR;
Dek Gin Yang, Chungcheongbuk-do, KR;
Jung Wook Hwang, Gyeongsangnam-do, KR;
Kyu Hyok Yim, Chungcheongbuk-do, KR;
Jung Hun Chai, Jeollabuk-do, KR;
Young Ho Lee, Daegu, KR;
Kwang Yune Kim, Daejeon, KR;
Dong Gi an, Chungcheongnam-do, KR;
Yang Je Lee, Chungcheongbuk-do, KR;
Dek Gin Yang, Chungcheongbuk-do, KR;
Jung Wook Hwang, Gyeongsangnam-do, KR;
Kyu Hyok Yim, Chungcheongbuk-do, KR;
Jung Hun Chai, Jeollabuk-do, KR;
Young Ho Lee, Daegu, KR;
Kwang Yune Kim, Daejeon, KR;
Dong Gi An, Chungcheongnam-do, KR;
Samsung Electro-Mechanics Co., Ltd., Kyunggi-Do, KR;
Abstract
The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit board, in which an internal circuit pattern exposed for use in an external pad and a mounting pad is protected from external environments using a resist cover by window etching the base copper foil of a flexible region upon formation of an external circuit pattern as opposed to using a resist cover. Thus the number of fabrication processes and the fabrication costs are decreased and the increase in defect rates due to contamination is prevented, resulting in maximized reliability.