The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2007

Filed:

Feb. 27, 2004
Applicants:

Koung-su Shin, Suwon, KR;

Sun-yong Choi, Sungnam, KR;

Chung-sam Jun, Suwon, KR;

Dong-chun Lee, Hwasung-gun, KR;

Kwang-jun Yoon, Yongin, KR;

Inventors:

Koung-Su Shin, Suwon, KR;

Sun-Yong Choi, Sungnam, KR;

Chung-Sam Jun, Suwon, KR;

Dong-Chun Lee, Hwasung-gun, KR;

Kwang-Jun Yoon, Yongin, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/02 (2006.01); G01B 11/14 (2006.01); G01B 11/28 (2006.01); G01N 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.


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