The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Mar. 26, 2002
Applicants:
Hideki Kitada, Kawasaki, JP;
Noriyoshi Shimizu, Kawasaki, JP;
Nobuyuki Ohtsuka, Kawasaki, JP;
Takayuki Ohba, Kawasaki, JP;
Inventors:
Hideki Kitada, Kawasaki, JP;
Noriyoshi Shimizu, Kawasaki, JP;
Nobuyuki Ohtsuka, Kawasaki, JP;
Takayuki Ohba, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer interconnection structure that offers a fast semiconductor operation is realized by employing copper wiring, electro migration of which is prevented from occurring by providing a via plug that includes a layer of a high melting-point metal, such as tungsten.