The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Oct. 21, 2005
Hiroaki Inoue, Tokyo, JP;
Norio Kimura, Fujisawa, JP;
Xinming Wang, Fujisawa, JP;
Moriji Matsumoto, Fujisawa, JP;
Makoto Kanayama, Fujisawa, JP;
Hiroaki Inoue, Tokyo, JP;
Norio Kimura, Fujisawa, JP;
Xinming Wang, Fujisawa, JP;
Moriji Matsumoto, Fujisawa, JP;
Makoto Kanayama, Fujisawa, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device has an embedded interconnect structure in which an electric conductor, such as copper or silver, is embedded in fine recesses formed in a surface of a semiconductor substrate, and also has a protective film formed on surfaces of exposed interconnects that define the interconnect structure, to protect the interconnects. The protective film has a flattened surface.