The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Jul. 25, 2005
Kevin C. Weaver, San Jose, CA (US);
Hiep V. Nguyen, Santa Clara, CA (US);
Henry Acedo, Morgan Hill, CA (US);
Kevin C. Weaver, San Jose, CA (US);
Hiep V. Nguyen, Santa Clara, CA (US);
Henry Acedo, Morgan Hill, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A method to de-packaging a semiconductor device to access and test the die within the package. The method involves initially removing molding compound from a first surface of the package to expose the underlying die attach pad of the package. A mask is then formed over the die attach-pad. An etching solution is subsequently introduced through an opening in the mask to etch away the die attach pad. Once the etching is complete, the die attach film is removed. An ohmic contact is then formed on the exposed back surface of the die. The ohmic contact is used to ground the die so that the electrical circuitry on the device will operate properly. Once grounded, the circuitry on the die can be electrically tested and debugged.