The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2007

Filed:

May. 12, 2006
Applicants:

Cui-jun LU, Shenzhen, CN;

Jin-song Feng, Shenzhen, CN;

Qiao Chen, Shenzhen, CN;

Inventors:

Cui-Jun Lu, Shenzhen, CN;

Jin-Song Feng, Shenzhen, CN;

Qiao Chen, Shenzhen, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires () therein. The heat dissipation device includes a heat sink assembly. A wire fixture () is mounted on the heat sink assembly and configured for fixing the wires thereto. The wire fixture includes a mounting plate () positioned on the heat sink assembly. A bridge () projects from the mounting plate to form a receiving room () below the bridge. The wires are securely bound together via the wire fixture so as not to be loosened by vibration.


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