The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Dec. 27, 2005
Kenichi Tanaka, Kodaira, JP;
Tomonori Tanoue, Machida, JP;
Hidetoshi Matsumoto, Kokubunji, JP;
Hiroshi Ohta, Kawasaki, JP;
Kazuhiro Mochizuki, Tokyo, JP;
Hiroyuki Uchiyama, Musashimurayama, JP;
Kenichi Tanaka, Kodaira, JP;
Tomonori Tanoue, Machida, JP;
Hidetoshi Matsumoto, Kokubunji, JP;
Hiroshi Ohta, Kawasaki, JP;
Kazuhiro Mochizuki, Tokyo, JP;
Hiroyuki Uchiyama, Musashimurayama, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
This invention is intended to provide an HBT capable of achieving, if the HBT is a collector-up HBT, the constriction of the emitter layer disposed directly under an external base layer, and reduction in base-emitter junction capacity, or if the HBT is an emitter-up HBT, reduction in base-collector junction capacity. For the collector-up HBT, window structures around the sidewalls of a collector are used to etch either the emitter layer disposed directly under the external base layer, or an emitter contact layer For the emitter-up HBT, window structures around the sidewalls of an emitter are used to etch either the collector layer disposed directly under the external base layer, or a collector contact layer. In both HBTs, the external base layer is supported by a columnar structure to ensure mechanical strength.