The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2007

Filed:

Jan. 06, 2004
Applicants:

Minoru Matsuzawa, Tokyo, JP;

Tatsuro Yoshida, Tokyo, JP;

Inventors:

Minoru Matsuzawa, Tokyo, JP;

Tatsuro Yoshida, Tokyo, JP;

Assignee:

Sipec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 31/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate supporting apparatus for supporting a substrate or wafer in a non-contact state by Bernoulli theorem is disclosed. The substrate supporting apparatuscomprises a housing, a rotatable chuckwhich is disposed in the housing, which is provided at its central portion with a hollowand which supports a substrate, and a cylindrical nozzle memberwhich is disposed in the housing, which has a nozzle holeand which can vertically move in the hollow. A nozzle holeis formed in a central portion of the nozzle member. Gas is discharged from a gas sourcethrough the nozzle hole, thereby holding the substrateby an upper surface of the chuckin a non-contact state. When the substrateis to be detached, the nozzle memberis moved upward while discharging gas from the nozzle hole, thereby floating the substrate


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