The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2007
Filed:
Sep. 23, 2005
James R. Emmert, Corvallis, OR (US);
Charles Evans, Corvallis, OR (US);
Michael Alvin Rencher, Corvallis, OR (US);
Haoran Duan, Corvallis, OR (US);
James R. Emmert, Corvallis, OR (US);
Charles Evans, Corvallis, OR (US);
Michael Alvin Rencher, Corvallis, OR (US);
Haoran Duan, Corvallis, OR (US);
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Abstract
A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.