The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2007

Filed:

Jun. 25, 2004
Applicants:

Chuan-yi Lin, Hsin-Chu, TW;

Shien-yang Wu, Hsin-Chu, TW;

Yee-chia Yeo, Singapore, SG;

Inventors:

Chuan-Yi Lin, Hsin-Chu, TW;

Shien-Yang Wu, Hsin-Chu, TW;

Yee-Chia Yeo, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to the present invention, the integrated circuit includes isolation field regions on a semiconductor substrate. Gate dielectrics are formed on a surface of a substrate. Gate electrodes are formed on the gate dielectrics. A photo resist is formed covering the active regions. Dummy patterns are selectively etched. A dummy substrate is selectively etched. The photo resist is then removed. A pair of spacers is formed along opposite sidewalls of the gate electrode and the gate dielectric. The source and drain are formed on the surface of said substrate and on opposite sides of the gate. Silicide is formed on the gate electrode, source, and drain. A layer of inter-level dielectric is then formed. A contact opening and metal wiring are then formed.


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