The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Sep. 01, 2005
Sanh D. Tang, Boise, ID (US);
Troy Gugel, Boise, ID (US);
John Lee, Boise, ID (US);
Fred Fishburn, Woodbridge, VA (US);
Sanh D. Tang, Boise, ID (US);
Troy Gugel, Boise, ID (US);
John Lee, Boise, ID (US);
Fred Fishburn, Woodbridge, VA (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods for forming a redistribution layer on microfeature workpieces, and microfeature workpieces having such a redistribution layer are disclosed herein. In one embodiment, a method includes constructing a dielectric structure on a microfeature workpiece having a substrate and a terminal carried by the substrate, and removing a section of the dielectric structure to form an opening. The opening has a first portion extending through the dielectric structure and exposing the terminal and a second portion extending to an intermediate depth in the dielectric structure. The second portion is spaced laterally apart from the terminal. The method further includes forming a conductive layer on the microfeature workpiece with the conductive layer in electrical contact with the terminal and disposed in the first and second portions of the opening.