The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2007
Filed:
Mar. 10, 2003
Hiroshi Honma, Yokohama, JP;
Noriyuki Ooroku, Yokohama, JP;
Hitoshi Odashima, Yokohama, JP;
Toru Mita, Yamato, JP;
Chuichi Miyazaki, Akishima, JP;
Takashi Wada, Kodaira, JP;
Hiroshi Honma, Yokohama, JP;
Noriyuki Ooroku, Yokohama, JP;
Hitoshi Odashima, Yokohama, JP;
Toru Mita, Yamato, JP;
Chuichi Miyazaki, Akishima, JP;
Takashi Wada, Kodaira, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
To improve the reliability and yield of a thin-type semiconductor device as used for a stack-type flash memory, the semiconductor device is manufactured by upheaving each of semiconductor chips (semiconductor devices) obtained by dicing a semiconductor wafer on an adhesive sheet from a backside via the adhesive sheet using an upthrow jig to which ultrasonic vibration is applied so as not to break through the adhesive sheet, and by picking up each semiconductor chip.