The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Aug. 18, 2005
Katsuhisa Osako, Ibaraki, JP;
Naoto Shioi, Ibaraki, JP;
Daisuke Itoh, Ibaraki, JP;
Hideyuki Gotoh, Ibaraki, JP;
Yorishige Matsuba, Ibaraki, JP;
Kazuki Tateyama, Kanagawa, JP;
Yasunari Ukita, Kanagawa, JP;
Masao Segawa, Kanagawa, JP;
Takuo Kikuchi, Kanagawa, JP;
Katsuhisa Osako, Ibaraki, JP;
Naoto Shioi, Ibaraki, JP;
Daisuke Itoh, Ibaraki, JP;
Hideyuki Gotoh, Ibaraki, JP;
Yorishige Matsuba, Ibaraki, JP;
Kazuki Tateyama, Kanagawa, JP;
Yasunari Ukita, Kanagawa, JP;
Masao Segawa, Kanagawa, JP;
Takuo Kikuchi, Kanagawa, JP;
Harima Chemicals, Inc., Kakogawa-shi, JP;
Toshiba Corporation, Tokyo, JP;
Abstract
The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.